The next Xiaomi 13 renders demonstrate the company’s shift in design strategy for its upcoming premium series. These renderings by CompareDial and OnLeaks suggest that the Xiaomi 13 will have flat sides in addition to a flat-screen.
The phone’s front has a flat surface, sharp edges, and a little bezel. A hole-punch camera is positioned in the middle of the phone’s top surface. Meanwhile, the phone’s sides have also been flattened, giving it a rather slab-like, boxy appearance.
The back glass still has a little edge curve, making it a little bit simpler to grasp. Retaining its familiar huge square shape with lenses occupying three of the four corners, the camera island has also been upgraded.
We also know how big the phone will be; its measurements are 152.8 x 71.5 x 8.3 mm. The camera hump increases the thickness to 10.3mm. The most recent Qualcomm Snapdragon 8 Gen 2 chip is said to be powering the phone.
via - GSMArena
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