Today in a post by the General Manager of Lenovo’s smartphone division in China released information on the chipset of the Lenovo Legion 3 Pro aka Legion Duel 3 via a post. In the post, the General Manager confirmed that the Lenovo Legion 3 Pro will be powered by Qualcomm Snapdragon 898 chipset (SM8450).
Furthermore, as seen in the previous device the Legion 2 Pro aka Duel 2 had two fans which means the latest Lenovo Legion 3 Pro will probably have active cooling as well; to help cool the new Snapdragon chip and keep it working at its peak performance rate. It is also reported the GPU will also be upgraded in the new chip.
Moreover currently, only rumors and speculations are going around the new Snapdragon 898 chipset as no official information has been released. The rumors suggest that the new chipset is 20% faster than the 888.
It is expected that the Lenovo Legion 3 Pro might be one of the first handsets that will be available with this latest chipset. It should be noted that depending on the region this handset might be known as Lenovo Legion 3 Pro or Legion Duel 3.
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