There was a recent post on Weibo for the Honor Magic 3 revealing a more detailed design of the Rare-Camera-Setup. The image shows a circular camera housing, containing a five-camera setup. It also revealed in the image a 100x periscope camera and its digital zoom output.
Recent rumors suggest that the Honor Magic 3 Pro will have a double-curved screen, with a 3D structured light solution to support a higher level of face recognition. The handset is equipped with Snapdragon 888 Plus SoC and will be the first model to have such a chipset in the world. It is also speculated that the handset will have an ultra-high thermal conductivity of graphene for efficient heat dissipation. Along with all these, the device will also have either the new generation of Magic UI 5.0 or the core Android Harmony system.
Furthermore, the company is rumored to use the latest 3D nano-microcrystalline process for production. This process can perfectly balance the hardness and strength of ceramic materials with the 3D plasticity and high transparency of glass materials. In the Offical pre-release video of the Honor Magic 3, the device passed the waterproof and drop-proof performance tests with amazing results.
All this information suggests that the Honor Magic 3 will be one amazing device, more information on this handset might be given by the company at the launch event on August 12th. So, be on the lookout for this if you are interested in this device.
Also, Read: Redmi 10 series to get a 50MP camera sensor.