Magic3 series to come with Snapdragon 888 Plus

Qualcomm just announced its latest Snapdragon 888 Plus chipset and Honour already have plans for the chipset to appear in its upcoming Magic3 series.

This report comes directly from the President of Product Line at Honor, Ms Fang Fei. According to Fei, Honor will be able to develop “a mobile experience that will fulfil the needs of even the most demanding users” thanks to the platform’s industry-leading performance and AI advancements.

The news is crucial for Honor, which just split from Huawei in order to maintain its ties with American businesses. The company can now use goods containing American IP, such as the Snapdragon 888 Plus, as a standalone brand.

Two weeks prior to this, Honor had made another important announcement that the future Honor phones that will include Google Mobile Services.

So while we don’t know much about the upcoming Magic3 series, one thing is for sure that this lineup will be a flagship series.

via - GSMArena

Also, Read – TCL 20 series makes its way to the US market.

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